Sixfab / Custom Edge AI Computer Design

OEM / ODM hardware program

Custom Edge AI Computer Design & Manufacturing

We take your product from requirements to certified, shipping hardware — design, certification and volume manufacturing under one contract, built on the Raspberry Pi ecosystem with the AI accelerator your workload actually needs. From block diagram to shipped fleet.

CES 2026 Best of Innovation Official DEEPX Partner ISO 9001 manufacturing
Straight answers

What everyone asks first

What does it cost?
NRE quoted per program, billed against milestones you approve one at a time. Feasibility is free. Pricing →
Is there a minimum order?
No hard minimum. We have run fully custom programs for a single research unit. Volumes →
How long does it take?
2–6 weeks to configure and brand, 8–16 semi-custom, 24–25 fully custom. Process →
Who handles CE / FCC / IC?
We do — campaigns, test reports, labelling and the Declaration of Conformity. Certification →
Who owns the design?
Your application, models and foreground IP are always yours. Design IP is per contract. IP →
Will my model run on the NPU?
Checked free at feasibility — compile, INT8 accuracy and CPU headroom, before any money moves. How we check →

Need a HAT, add-on board or carrier board rather than a complete computer? That is its own, faster program: custom Raspberry Pi HAT and hardware development — typically 6–8 weeks to a first prototype.

Service tiers

Three ways to get custom hardware

Start at the lowest tier that meets your requirement — faster, cheaper, lower risk — and we will say so if you have picked the wrong one. No hard minimums on any route.

Tier 1

Configure & Brand

Brand · imageNEWEnclosureINHERITEDCarrier boardINHERITEDCompute moduleFIXED

An existing Sixfab product with your branding, enclosure colour, labelling, OS image, SKU and packaging. No schematic change, so no re-certification.

Hardware redesign
None
NRE
None or nominal
Re-certification
Not required
Lead time
2–6 weeks
Most programs start here

Tier 2

Semi-Custom Derivative

Brand · imageNEWEnclosureMODIFIEDCarrier boardMODIFIEDCompute moduleFIXED

A proven Sixfab platform changed where your product needs it — connectors, I/O mix, form factor, cellular variant, thermal solution, enclosure. You inherit a validated design and a certification baseline.

Hardware redesign
Carrier / mechanical
NRE
Milestone-billed
Re-certification
Delta testing
To production release
8–16 weeks

Tier 3

Fully Custom Design

Brand · imageNEWEnclosureNEWCarrier boardNEWCompute moduleFIXED

A ground-up carrier board around a Raspberry Pi compute module and the accelerator your workload needs — through full CE/FCC/IC certification and volume manufacturing.

Hardware redesign
Complete
NRE
Milestone-billed
Re-certification
Full campaign
To production release
24–25 weeks
Off-the-shelf, configure, semi-custom and fully custom compared
 Off-the-shelfTier 1 Tier 2Tier 3
Best when You need units now and standard I/O fits The hardware fits; the brand and image don’t You need a different I/O set or form factor Nothing on the market fits your envelope
Engineering NoneConfiguration only Carrier + mechanicalFull electrical, thermal, mechanical
To production Ships from stock2–6 weeks 8–16 weeks24–25 weeks
CE / FCC / IC CertifiedInherited Delta testing — only affected tests re-run Full campaign, run by Sixfab
Design IP SixfabSixfab Negotiated per contract — including a productisation route where Sixfab waives NRE and retains the design IP

Scroll the table sideways →

Pre-certified cellular modules on every route; a production build runs about 8 weeks once a design is released. Research and internal-use builds that never go to market skip certification entirely — removing both its cost and its weeks.

Capabilities

What we build, and where our scope ends

Every discipline below is delivered in-house or under our direct management, with a named deliverable at each milestone. Where a partner stops matters as much as what it offers, so we publish that too.

Electrical design

Schematic capture, PCB layout, power architecture and signal integrity.

RF & antenna integration

Selection, placement and matching for cellular, Wi-Fi and GNSS, with pre-compliance before the lab.

Mechanical, thermal & industrial design

Enclosure engineering, fanless thermal design for sustained AI load, and the product’s look and finish.

Power systems

Industrial DC and PoE, plus battery and solar designs with charging, protection and deep-sleep budgets.

AI enablement

Accelerator selection and benchmarking on your models, plus quantisation and NPU optimisation as contracted work.

Display & HMI

Touchscreen and panel integration on the carrier, from kiosk displays to compact status HMIs.

Certification & compliance

CE, FCC and IC campaigns at accredited labs, run concurrently with design-for-manufacture, through to labelling.

Manufacturing & lifecycle

Production in our own ISO 9001 facility with EU and USA fulfilment — provisioning, flashing, labelling, packaging — then EOL monitoring and RMA handling.

Devices arrive connected

Programs can ship provisioned into ALPON Cloud, so the fleet is remotely manageable from the first unit.

Toolchain on day one

Everything compiles from ONNX, so your pipeline stays portable. GStreamer video plugins, and a starter OS image with driver, runtime and cellular stack configured.

Where our scope ends

Ongoing software maintenance — OS updates, cybersecurity, OTA — sits with your team or a software partner. We supply a working starter image; it is a bring-up deliverable, not a maintained product. Medical and safety-critical approvals (IEC 62304, ISO 13485, FDA) are outside our scope, as are workloads needing GPU-class compute or a non-Raspberry-Pi module. Certification beyond CE/FCC/IC is agreed per program.

Reference architecture

Raspberry Pi Compute Module 5 (or CM4), 2–16 GB, in production to at least January 2036.

Reference architectureA connected edge AI computer: cameras and sensors, I/O and storage feed a Raspberry Pi CM5, which is the one fixed block. An M.2 AI accelerator sits on PCIe, with cellular connectivity and the power tree around it, all inside a thermally designed enclosure. Every block except the compute module is a design variable.Raspberry Pi CM5fixed · to Jan 2036M.2 AI acceleratorDEEPX DX-M1 defaultPCIeCameras / sensorsCSI · USB · GMSLI/O & interfacesRS-485 · CAN · GPIOStorageeMMC · NVMeCellular / Wi-Fipre-certified modulePower treePoE · 9–36 V · solarEnclosure · thermal · industrial design

Solid outline = fixed. Dashed = design variable. Camera count, I/O mix, accelerator, power envelope and enclosure all change per program.

Silicon selection

How we choose the accelerator

DEEPX is our first option, and for most programs the last one too. It is also the part we have benchmarked hardest — which is how we know the workloads where something else wins, and design in that part instead.

Official DEEPX Partner

Why DEEPX is the default

  • We shipped on this silicon. The Sixfab AI HAT+ launched jointly with DEEPX in June 2026 — DX-M1 taken through design, bring-up and thermal, not just evaluated.
  • Direct engineering escalation. A failed compile or unsupported operator goes to DEEPX’s engineers, not into a ticket queue.
  • A known-good starting point. Carrier reference, power tree, thermal solution and a working OS image already exist. Weeks your program does not spend.

Deliberately not an exclusivity arrangement — nothing in it obliges us to put a DX-M1 in your product.

The method, in three steps

  • Start from DEEPX and try to break it. Your models compiled and profiled against DX-M1 first. If operators do not map, INT8 accuracy does not hold, or throughput misses your target, we say so and move on.
  • Measure on the real host. Vendor numbers come from x86 desktops with a full PCIe link. Your product is a compute module. We measure on what you are shipping — for every vendor, including ours.
  • The part has to outlive the product. Toolchain maturity, ARM64 support, published longevity and vendor viability weigh as heavily as throughput.

Beyond DEEPX we design in Hailo (8, 8L, 10H), MemryX MX3, Axelera Metis and NXP Ara-240. All M.2 parts, so the socket stays the same and the silicon is a per-program decision.

A worked example: a detection-heavy program

Same Raspberry Pi 5 host, same video, same models, measured July 2026.

Accelerator throughput, DEEPX DX-M1M versus Hailo-8Bars are scaled per row against that row’s faster part. DEEPX leads on all three detection workloads — 50.1 against 19.6 FPS on YOLOv8l, 34.1 against 13.5 on YOLOv8x, 178.7 against 96.7 on YOLO26n. Hailo-8 leads on semantic segmentation, 121.9 against 34.5 FPS. Measured July 2026 on one Raspberry Pi 5 8 GB host with identical video and models.Same host, same video, same modelsDEEPX DX-M1MHailo-8YOLOv8l throughput50.119.6YOLOv8x throughput34.113.5YOLO26n throughput178.796.7Semantic segmentation34.5121.9Hailo-8 takes this one by more than 3×. On a segmentation-dominant pipeline we design around Hailo.

Bars scale per row against that row’s faster part. Read the last row: on segmentation Hailo-8 wins by more than 3×, and on a segmentation-dominant pipeline we design around Hailo — the feasibility findings say so in writing. Full benchmark →

How a program runs

Eight phases, three go/no-go gates

The schedule we quote against for a Tier 3 program; Tier 2 compresses phases 3 to 7. Certification runs concurrently with design-for-manufacture, not after it.

Programme timelineEight phases from feasibility to production, with three go/no-go gates after feasibility, after contract, and after your acceptance testing. Certification runs concurrently with design-for-manufacture from week 12.G11FeasibilityfreeG22Scope & contractwk 1–23Designwk 3–144Prototypewk 15–165Bring-upwk 17–19G36Your UATwk 20–227Certificationwk 23–258Production8 wk / buildcertification runs concurrently from wk 12
01

Feasibility review

A compatibility screen, not a design exercise: interfaces, power envelope, thermal headroom, and whether your model compiles and holds INT8 accuracy on each candidate accelerator. You get a written yes or no, an accelerator recommendation and the risks we found.

Free
Gate 1 — a no at this stage costs you nothing.
02

Scope, proposal and contract

Requirements fixed in writing: interfaces, environmental spec, certification targets, volumes and warranty. You get a statement of work and a milestone-billed schedule.

wk 1–2
Gate 2 — contract signature releases engineering. Nothing starts before it.
03

Design

Block diagram, schematic capture, PCB layout, then mechanical and thermal — each a milestone you approve, and each approval releases the next NRE instalment. You are never more than one milestone from being able to stop.

wk 3–14
04

Prototype build

Fully assembled prototypes built on the same process production will use — not hand-soldered one-offs that behave differently at volume.

wk 15–16
05

Bring-up and validation

Power sequencing, signal integrity, thermal under sustained inference, every interface and the cellular link. Pre-compliance radio testing starts here, while certification surprises are still cheap.

wk 17–19
06

Your acceptance testing

You run the hardware against your own application, models and field conditions. Your acceptance is the manufacturing trigger — not our opinion of the design.

wk 20–22
Gate 3 — your UAT acceptance is the go/no-go for manufacturing.
07

Certification and pre-production

Full CE, FCC and IC campaigns at accredited labs, run by Sixfab; pre-certified cellular modules remove the module-level burden. Design freeze happens here. You get test reports, the Declaration of Conformity, labelling artwork and a frozen BOM.

wk 23–25
08

Production and lifecycle

Volume manufacturing in our own facility, provisioning, flashing, labelling and packaging included. Then parts allocation, EOL monitoring, last-time-buy notices, RMA depot and an epidemic-failure clause.

8 wk / build

Typical for a Tier 3 program of moderate complexity — camera count, enclosure, environmental rating and certification scope all move it. Your quoted schedule is fixed at Gate 2.

Scope

Exactly who owns what

The most expensive misunderstanding in an ODM program is a responsibility nobody thought was theirs. Here is the split, before you sign anything.

Sixfab owns

  • Electrical, mechanical, thermal and enclosure design
  • Prototype builds and internal validation
  • CE/FCC/IC campaigns, test reports and hardware labelling. Sixfab is hardware manufacturer of record and holds the Declaration of Conformity for Sixfab-branded product; for own-brand product EU rules generally place it with you, and the contract records the split
  • Volume manufacturing, provisioning, flashing, labelling and packaging
  • A starter BSP, firmware and OS image to boot your hardware
  • Parts supply, EOL monitoring and last-time-buy notification
  • Warranty, RMA depot and the epidemic-failure clause

You own

  • Your application, trained model and dataset — and its field accuracy, unless you contract us to work on it
  • All software upkeep after delivery: BSP and firmware maintenance, kernel and package updates
  • Cybersecurity, secure boot and OTA patching
  • Your foreground IP
  • A rolling forecast on production programs, so parts are bought ahead of demand
  • Excess-and-obsolete and last-time-buy liability on parts bought against that forecast
  • Legality and permitted end-use of your application in your markets

Changes after design freeze run through a formal, priced engineering change order — that is what keeps a certification valid. AI camera and vision programs are screened for export control and end-use before contract; some applications we decline.

Proof

What we have built, and what programs look like

Designed and shipped in-house

ALPON X5 AI — our own reference program

An industrial edge AI gateway on Raspberry Pi CM5 with a DEEPX DX-M1 NPU, integrated 4G LTE and eSIM, in a fanless aluminium enclosure. It won CES 2026 Best of Innovation in Enterprise Tech, and Raspberry Pi covered the win directly.

Every capability behind it — CM5 carrier design, PCIe to an M.2 NPU, integrated cellular, thermal design for sustained inference, a CE/FCC/IC campaign — is what we apply to your product.

Raspberry Pi CM5 DEEPX DX-M1 4G LTE + eSIM Fanless industrial

Typical program shapes

Multi-camera vision gateway

Four CSI cameras into a CM5 carrier, inference on a DX-M1, results over LTE. Fanless, −20 to 60 °C, IP-rated, PoE and 12–24 V.

DIN-rail industrial controller

CM5 plus NPU on a narrow DIN form factor with isolated RS-485, CAN, digital I/O and a 9–36 V rail. Wide temperature, no moving parts.

Battery / solar remote node

Duty-cycled inference on a power-budgeted design: solar MPPT, battery management, deep-sleep rails and LTE-M or NB-IoT backhaul.

Consolidating a HAT stack

The most common Tier 2 request: three or four stacked HATs collapsed into one manufacturable board with the same function and a certification path. If the board itself is the deliverable, that is our custom Raspberry Pi HAT and hardware development service.

White-label gateway line

A Tier 1 or Tier 2 derivative shipped under your brand with your enclosure finish, labelling, OS image and SKU — a product line without a hardware team.

Small-batch research build

A handful of ruggedised CM5-plus-NPU units for a field study. No certification campaign because they never go to market. The smallest we have run was a single unit.

Specific customer programs are under NDA; these describe the engineering shape, not named deployments.

Where these devices go

Industrial & smart factory Physical security & surveillance Robotics & autonomy Smart cities & transport Agriculture & environment Energy & utilities Retail & digital signage Logistics & fleet

Not listed: medical devices and other safety-critical applications requiring IEC 62304, ISO 13485 or FDA pathways. We do not hold those quality systems.

Longevity

Designing a product that still exists in 2032

2026 has been the hardest procurement year in a decade — LPDDR4 pricing rose sharply and Raspberry Pi raised prices twice, both times citing memory. Supply strategy is a design input now, not a footnote.

Platform longevity to 2036Raspberry Pi Compute Module 5 is committed to production until at least January 2036, which covers the full seven-to-ten-year field life of a product designed in 2026. A Raspberry Pi 6 is not expected before early 2028.2026202720292031203320352037Raspberry Pi CM5 — committed to production to at least Jan 2036A product designed now, with a seven-to-ten-year field lifePi 6 not expected before early 2028 (RPi CEO, May 2026 AMA)

In the contract

  • A price-validity and adjustment clause — nobody pretends a 2026 BOM quote holds for two years
  • Rolling forecast on production programs, with E&O and last-time-buy liability recorded
  • EOL monitoring and last-time-buy notification across the BOM, run by us
  • Warranty term, RMA depot process and an epidemic-failure clause

In the design

  • Parts with published longevity commitments preferred over marginally cheaper alternatives
  • Second-source footprints where package and pinout allow
  • The accelerator on an M.2 socket rather than soldered down, so a vendor problem is absorbed at the socket, not in a board respin
  • Pre-certified cellular modules, so a module change does not trigger a full campaign
  • Single-source risk flagged explicitly in the feasibility report, before you commit

Why Sixfab

Award-winning design, in-house

The ALPON X5 AI — CES 2026 Best of Innovation — was designed by the same engineers who will run your program.

Raspberry Pi Approved Design Partner

Reviewed and approved on technical and commercial capability. Roadmap access and a named contact — not a reseller relationship.

Connectivity is not an add-on

A decade of shipping cellular hardware for Raspberry Pi. Cellular plus AI on one board is uncommon; RF, power and thermal interact, and we design them together.

We are the manufacturer of record

Design, certification and production under one roof, in our own ISO 9001 facility. Schedule, gates and scope boundaries are published on this page.

Questions

Frequently asked questions

Scope, cost, timelines and ownership. If yours is not here, ask us directly.

Who can design a custom edge AI computer for my product?

Sixfab designs, certifies and manufactures custom edge AI computers built on Raspberry Pi compute modules, with a DEEPX NPU as our validated default — and Hailo, MemryX, Axelera or NXP where the workload calls for it — plus optional LTE/5G. We are a Raspberry Pi Approved Design Partner and act as hardware manufacturer of record, which means one company covers electrical design, mechanical and thermal design, CE/FCC/IC certification and volume manufacturing. Programs range from single-unit research builds to multi-year volume production; the free feasibility review recommends the most economical route for yours.

How long does it take to design a custom embedded computer?

Our typical fully custom program runs 24–25 weeks from kick-off to production release: onboarding 1 week, budgeting and contract 1 week, design 12 weeks, prototype build 2 weeks, bring-up and internal validation 3 weeks, your acceptance testing 3 weeks, and pre-production 2–3 weeks. Volume manufacturing then runs about 8 weeks per build — so first delivered production units land around weeks 32–33 for a fully custom program.

A semi-custom derivative of an existing Sixfab platform typically lands in 8–16 weeks. A configure-and-brand program is 2–6 weeks. Certification runs concurrently with design-for-manufacture rather than after it, which keeps the lab off the critical path.

How much does it cost to design a custom edge AI computer?

Non-recurring engineering is quoted per program and billed in instalments against customer-approved design milestones — block diagram, then schematics, then PCB layout, then mechanicals. You approve each milestone before the next instalment is invoiced, so you are never more than one milestone from being able to stop.

NRE scale is driven by the number of high-speed interfaces, the enclosure and thermal complexity, the environmental rating, and the certification scope. The proposal keeps NRE and unit price as two separate numbers, so design cost never hides inside the per-unit cost. There is also a productisation route: on suitable programs Sixfab will waive the NRE at production in exchange for retaining the design IP, with a committed starting MOQ from you and optionally Sixfab branding. Feasibility is free and carries no cost obligation.

What is the minimum order quantity for custom edge AI hardware?

There is no hard minimum. We have run fully custom programs for single-unit research builds, and configure-and-brand orders scale down to small batches. What changes with volume is the unit economics: design, tooling and certification costs are fixed, so at low volumes they dominate the unit price and at higher volumes they disappear into it.

That is exactly what the free feasibility review lays out — the cost of each route at your volumes, including the case where ordering a standard ALPON X5 AI or Sixfab AI HAT+ and building on top is the better decision.

Do research or internal-use builds need certification?

No. CE, FCC and IC apply to products placed on the market. A research or internal build that never goes to market can skip the certification campaign entirely, which removes both the campaign cost and its weeks from the schedule — delivery is typically at the validated-prototype stage. Custom I/O, odd form factors and rugged enclosures for lab or field experiments are normal programs here, not exceptions.

Grant-funded and institutional projects are welcome; the written feasibility findings give a procurement office a defined scope to quote against.

Does Sixfab handle CE, FCC and IC certification?

Yes. We run the certification campaigns at accredited labs, produce the test reports and apply compliant hardware labelling. Sixfab acts as hardware manufacturer of record and holds the Declaration of Conformity for products placed on the market under the Sixfab name. If you sell under your own brand, EU rules generally make you the manufacturer of record — the contract records the split, and we support it with the technical file and test reports. We design with pre-certified cellular modules, which removes the module-level certification burden and, in many cases, device-level acceptance by the mobile network operator as well — one of the longest and most expensive steps in a connected-product program. Which networks still require device acceptance is confirmed at feasibility, per target market.

What this does not cover: safety-critical and medical device regimes such as IEC 62304, ISO 13485 or FDA pathways. We do not hold those quality systems.

Who owns the IP in a custom design?

You own your foreground IP — your application, your trained models, your datasets and anything specific to your product. Sixfab retains its background and platform IP, the reusable design blocks and know-how we brought to the program.

Ownership of the custom design itself is negotiated per contract. On the standard route you pay NRE and the statement of work sets out the arrangement — including which design artefacts (schematics, layout, BOM, test specifications) transfer to you and at which milestone, and what happens to manufacturing rights if Sixfab could not continue to build. Ask for both in the proposal; they are standard topics, not special requests. On the productisation route, Sixfab waives the NRE at production and retains the design IP in exchange — a trade of ownership for cash flow that suits some programs and not others. Both options are laid out in the proposal.

What is the difference between an OEM, an ODM and a design partner?

An OEM arrangement means the product is designed to your specification and built for you to sell under your brand. An ODM arrangement means the manufacturer does the design work as well, and you buy the finished result. A Raspberry Pi Approved Design Partner is a separate thing entirely: a company Raspberry Pi has reviewed and approved on technical and commercial capability, giving it roadmap access, direct technical support and a named contact at Raspberry Pi.

Sixfab operates as both OEM and ODM, and is an Approved Design Partner. Practically, that combination means the design, the certification and the supply relationship sit with one company rather than three.

Can I customise an existing Sixfab product like the ALPON X5?

Yes, and it is usually the right starting point. A Tier 2 semi-custom derivative inherits a validated design and a certification baseline, so you change only what your product actually needs — connector set, I/O mix, form factor, cellular variant, thermal solution or enclosure. That typically means 8–16 weeks and delta certification testing rather than 24–25 weeks and a full campaign. If only branding, labelling and the OS image need to change, Tier 1 is faster still and requires no re-certification at all.

Can Sixfab design just a HAT or carrier board?

Yes. Board-level work — HATs, add-on boards, CM4/CM5 carrier boards and other custom PCBs — is its own service: custom Raspberry Pi HAT and hardware development. Board-level programs run much faster than complete computers: typically 6–8 weeks to a first prototype and around 12 weeks to production.

The split is simple. That service delivers the board, with enclosure work limited to customising existing off-the-shelf enclosures; this one delivers a complete, certified edge AI computer — full mechanical and industrial design, the certification campaign and volume manufacturing included. The same free feasibility review applies to both, and if you start on the wrong page we will simply route you to the right one.

What AI accelerator options are available for custom designs?

Our default is DEEPX — the DX-M1 (M.2 2280) or DX-M1M (M.2 2242) — and it is the part we have shipped in our own product. Beyond it, the shortlist covers Hailo (8, 8L, 10H), MemryX (MX3), Axelera (Metis) and NXP (Ara-240), plus anything else that clears evaluation. They are all M.2 parts on the carrier, so the socket stays the same and the silicon remains a per-program decision.

Each wins somewhere different. DEEPX leads on detection throughput per watt with on-board memory and has the broadest published model zoo, which is why it is where we start. Hailo has the lowest idle power and the deepest Raspberry Pi ecosystem support, and takes semantic segmentation comfortably; Hailo-10H adds on-device generative AI with its own 4–8 GB of memory. MemryX has the fastest bring-up and explicitly documented ARM64 support. Axelera has the highest raw CNN throughput per slot. NXP’s Ara-240 is the only one with a dated, per-part longevity commitment — listed in NXP’s Product Longevity Program to April 2036, where Hailo publishes 7–10 years of supply continuity as a policy rather than a date. The choice is made at feasibility against your actual models, not against a datasheet.

Is Sixfab tied to DEEPX? Can you design in Hailo, MemryX or Axelera instead?

DEEPX is our first option, and deliberately so. It is the silicon in our own shipped product, so a reference carrier, power tree, thermal solution and working OS image exist before your program starts, and a compile or quantisation problem gets escalated to DEEPX’s engineers rather than into a support queue. For most programs that is the fastest route to working hardware.

It is not exclusivity, and nothing in the arrangement obliges us to put a DX-M1 in your product. Hailo we have benchmarked on our own bench and design in regularly — on semantic segmentation it beat DEEPX by more than three times in the same test run, and on that workload it is what we recommend. MemryX, Axelera and NXP we have evaluated and will design in on request. If you arrive with a part already chosen, we design around it.

In short: DEEPX first because we know it best and it wins most often on the workloads we see — others whenever the measurements say otherwise.

Will the accelerator perform the same on a compute module as in vendor benchmarks?

Usually not, and the gap can be large. Vendor benchmarks are run on desktop PCs with full-bandwidth connections and generous power; a compute module offers less of both.

This is why we favour accelerators with on-board memory for bandwidth-heavy workloads, design dedicated power delivery on the carrier, and measure your models on the actual target before quoting performance. What you get at feasibility are measured numbers, not datasheet numbers.

Can I put a specific NPU — DEEPX, Hailo, MemryX — in my own product?

Yes. These are all M.2 modules, so they integrate into a custom carrier over PCIe. Sixfab designs the carrier, the power delivery — including the dedicated regulator most of them need — and the thermal solution around whichever part you choose, validates the compile and quantisation path for your specific models during the free feasibility review, and handles certification of the finished assembly.

If you have already standardised on a part, we will design around it — and say so if we think it is the wrong choice. If you have not, we will recommend one and show you the measurements behind the recommendation.

Will my model actually run on the NPU?

This is checked before any money changes hands. The free feasibility review includes an explicit compile and quantisation check on each candidate accelerator: are your model’s operators supported by that vendor’s toolchain, and does INT8 quantisation hold accuracy at a level your application can live with? Operator coverage varies more between vendors than throughput does, and it is the most common reason a promising part gets eliminated. We also check whether the Raspberry Pi has the CPU headroom your pipeline needs outside the NPU — pre- and post-processing, video handling, your application logic. A design that clears the NPU but starves the CPU is a design that fails in the field, and it is a failure mode we see regularly.

Who maintains the software after delivery?

You do. Sixfab supplies a starter BSP, firmware and OS image so the hardware boots and every interface is exercised — it is a bring-up deliverable, not a maintained software product.

Ongoing firmware and BSP maintenance, kernel and package updates, cybersecurity, secure boot and OTA patching are the customer’s responsibility. We raise this at feasibility because it is the single most common source of expectation mismatch in ODM programs, and it needs to be in your budget from the start — whether handled in-house or with a software partner. No software owner yet? Say so at feasibility and the findings will flag what your product will need.

Is Sixfab a Raspberry Pi Approved Design Partner?

Yes — Sixfab is listed in Raspberry Pi’s official Design Partner directory, and Raspberry Pi has publicly described Sixfab as a long-standing Design Partner. Per Raspberry Pi’s published Design Partner terms, the status provides periodic product roadmap updates, technical support including answers to schematic and layout queries, and a direct named contact at Raspberry Pi.

What happens if a component goes end-of-life mid-program?

We monitor the BOM for end-of-life notices and issue last-time-buy notifications. Where package and pinout allow, second-source footprints are designed in from the start, and single-source risk is flagged explicitly in the feasibility report before you commit. Commercially, excess-and-obsolete and last-time-buy liability sits with the customer on parts bought against your forecast. After design freeze, any change required by a part substitution runs through a formal, priced engineering change order.

Will Raspberry Pi 6 make my design obsolete?

Not on any timeline that should affect a program starting now. In a May 2026 AMA, Raspberry Pi’s CEO said a Pi 6 is not expected before early 2028 and described the company’s position as believing in “the CPU as the venue for much edge AI compute”, with acceleration added externally. Raspberry Pi has given no indication of a first-party NPU, though it has not formally ruled one out. Separately, Compute Module 5 carries a production commitment to at least January 2036. The compute-module-plus-external-accelerator architecture is the one Raspberry Pi itself points at.

What does the free feasibility review actually include?

It is a technical compatibility screen — no design work happens at this stage. We assess whether your requirement can be met on this platform: interfaces, ports and connectors, power envelope, thermal headroom, environmental targets, certification scope, and the accelerator choice for your specific models — including the compile and quantisation check and the CPU headroom analysis described above.

We respond within 24 hours, and findings come back in writing within one week of the technical call: a yes or no, the recommended architecture, and the risks we found. A no at this stage costs you nothing.

Next step

Start with the free feasibility review

Tell us what the product has to do, where it has to survive, and your expected volumes if you know them. We come back with a written yes or no, the recommended architecture and the risks we can already see. No hardware design work, no cost, no obligation.

Bring to the call

Your interface list, environmental targets, expected volume — one-off builds welcome — and your model, or at least its architecture and input resolution. Only have a prototype? Bring it. Mutual NDA on request.

You’ll leave with

A go/no-go on technical feasibility, an accelerator recommendation, an indicative tier, a schedule shape, and the economics of each route at your volumes.

Turnaround

First response within 24 hours. Feasibility findings within one week of the technical call, in writing.